1. Micro machining technology.
Micro nano machining, micro machining, and some precision machining technologies used in electronic manufacturing are collectively referred to as micro machining. Micro nano machining in micro machining technology is basically a plane integration method. The basic idea of planar integration is to build micro nanostructures on planar substrates by layer by layer superposition. In addition, the use of photon beam, electron beam and ion beam for cutting, welding, 3D printing, etching, sputtering and other processing methods also belong to micro machining.
2. Interconnection and encapsulation technology.
The interconnection between the chip and the circuit on the substrate, such as flip-flop bonding, lead bonding, through-hole silicon (TSV) technology, and the encapsulation technology after the interconnection between the chip and the substrate, these technologies are commonly referred to as chip packaging technology. Passive component manufacturing technology. It includes the manufacturing technology of passive components such as capacitors, resistors, inductors, transformers, filters, antennas, etc.
3. Optoelectronic packaging technology.
Optoelectronic packaging is the system integration of optoelectronic devices, electronic components and functional application materials. In optical communication system, optoelectronic packaging can be divided into chip IC level packaging, device packaging, micro electromechanical system manufacturing technology. A micro system that integrates sensors, actuators and processing control circuits on a single silicon chip by using micromachining technology.
4. Electronic assembly technology.
Electronic assembly technology is commonly referred to as board level packaging technology, electronic assembly technology is mainly surface assembly and through-hole insertion technology. Electronic materials technology. Electronic materials refer to the materials used in electronic technology and microelectronics technology, including dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and their alloys, magnetic materials, optoelectronic materials, electromagnetic wave shielding materials and other related materials. The preparation and application of electronic materials are the basis of electronic manufacturing technology.
